Product Information

■ FEATURS

CMP Pad conditioners are used for dressing poly-urethane based CMP pad. EHWA produces Pad Conditioners by three methods. BSL (Brazed Single Layer) Electroplated New BSL Type (Double Metal Layer)

■ CHARACTERISTICS

BSL products provide very fast removal rate as a result of the chemical bonding of the abrasive grit to a stainless steel body and the resulting increased chip clearance. Electroplated products provide improved flatness and better surface finish. The New BSL Type has a double metal layer. The first layer provides excellent diamond retention and the second layer provides a clean surface that minimizes micro-scratch. The New BSL Type Conditioner combines the best features of both giving rapid stock removal while providing a clean surface that minimizes micro-scratches and provides improved flatness.

■ DESCRIPTION of EHWA CMP PAD CONDITIONER

Classification Abrasive bonding Distinctive features Brazed Single Layer (BSL) Chemical reaction Chip pocket: Good circulation of slurry and swarf. Excellent Diamond Bonding: Prevents Diamond pull out. Diamond protrusion: Good removal rate. Electroplated Mechanical Tightening Good flatness: Minimize micro scratching Good wear resistance: Less contamination New BSL Type (Double Metal Layer) Chemical + Mechanical bonding Merits of Brazed Single Layer and Electroplated product Higher removal rate without Micro-scratch

■ APPLICATION

Machines (Model) Polished material Available grit size AMAT (Mirra, Reflexion) SpeedFam/IPEC(Auriga, CMP200/300, Avangard776,876) Ebara (EPO-222, 333) Strasbaugh (6DS-SP, 6ED) Lam (Teres), etc Oxide CMP: BPSG, TEOS, PSG Metal CMP: Al, W, Cu STI, PGI, Poly-Si CMP #30/40 - #120/140 Mesh

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【 ⇒ PRODUCTS INDEX 】

■ Products Information ■ ■Slurry Auto Mixing/Delivery System ■Chemical Auto Dilute and Delivery System ■DI Water Booster Pump System ■Chemical/Solvent Auto Delivery System ■Waste Drain Recovery System ■Silicon Wafer CMP Pad Conditioners